Hyderabad: Lords Institute of Engineering and Technology (LIET), Hyderabad, has announced an extension of the paper submission deadline for the International Conference on Smart Data Engineering (ICSDE 2026). Researchers, Academicians, Industry professionals and Students now have until July 25, 2026, to submit their research papers.
The two day international conference will be held on August 21-22, 2026, in a hybrid format, allowing participants to attend either online or in person. The event aims to provide a platform for researchers and experts from academia and industry to present innovative research, exchange ideas and discuss emerging trends in smart data engineering and related technologies.
According to the organizers, the conference will feature research presentations across a wide range of disciplines, including Artificial Intelligence, Machine Learning, Deep Learning, Big Data Analytics, Data Visualization, Cyber Security, Blockchain, Internet of Things (IoT), Smart Cities, Robotics, Autonomous Systems, Embedded Systems, VLSI, Green Computing, High Performance Computing, Mathematical Modeling and other emerging technology domains.
The organizing committee has stated that accepted and presented papers will be considered for publication in the Springer Lecture Notes Series, AIP and IEEE proceedings, subject to the respective publication policies and review process.
Important Dates
- Paper Submission Deadline (Extended): July 25, 2026
- Acceptance Notification: August 8, 2026
- Registration Deadline: August 12, 2026
- Conference Dates: August 21-22, 2026
The organizers have invited faculty members, research scholars, industry professionals and undergraduate and postgraduate students to participate and contribute high quality research papers. They have also encouraged academic institutions and professional networks to promote the conference among eligible participants.
Researchers interested in participating are advised to review the conference guidelines and submit their papers before the extended deadline.
